The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2008
Filed:
Sep. 06, 2006
Yan-kuin Su, Tainan, TW;
Kuan-chun Chen, Taichung Hsien, TW;
Chun-liang Lin, Tainan Hsien, TW;
Jin-quan Huang, Kaohsiung Hsien, TW;
Shu-kai HU, Kaohsiung, TW;
Yan-Kuin Su, Tainan, TW;
Kuan-Chun Chen, Taichung Hsien, TW;
Chun-Liang Lin, Tainan Hsien, TW;
Jin-Quan Huang, Kaohsiung Hsien, TW;
Shu-Kai Hu, Kaohsiung, TW;
National Cheng Kung University, Tainan, TW;
Abstract
An embedded metal heat sink for a semiconductor device and a method for manufacturing the same are described. The embedded metal heat sink for a semiconductor device comprises a metal thin layer, a metal heat sink and two bonding pads. The metal thin layer including a first surface and a second surface on opposite sides, wherein at least one semiconductor device is embedded in the first surface of the metal thin layer, and the semiconductor device has two electrodes with different conductivity types. The metal heat sink is deposited on the second surface of the metal thin layer. The bonding pads are deposed on the first surface of the metal thin layer around the semiconductor device and are respectively corresponding to the electrodes, wherein the electrodes are electrically and respectively connected to the corresponding bonding pads by at least two wires, and the bonding pads are electrically connected to an outer circuit.