The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2008
Filed:
Sep. 06, 2006
Yan-kuin Su, Tainan, TW;
Kuan-chun Chen, Taichung Hsien, TW;
Chun-liang Lin, Tainan Hsien, TW;
Jin-quan Huang, Kaohsiung Hsien, TW;
Shu-kai HU, Kaohsiung, TW;
Yan-Kuin Su, Tainan, TW;
Kuan-Chun Chen, Taichung Hsien, TW;
Chun-Liang Lin, Tainan Hsien, TW;
Jin-Quan Huang, Kaohsiung Hsien, TW;
Shu-Kai Hu, Kaohsiung, TW;
National Cheng Kung University, Tainan, TW;
Abstract
A method for manufacturing a heat sink of a semiconductor device is described. In the method, an adhesive tape is provided, wherein the adhesive tape includes a first surface and a second surface on opposite sides, and the first surface of the adhesive tape adheres to a surface of a temporary substrate. At least one semiconductor device is provided, wherein the semiconductor device includes a first side and a second side opposite to the first side, and the first side of the one semiconductor device is pressed and set into a portion of the second surface of the adhesive tape, and the second side of the one semiconductor device is exposed. A thin metal layer is formed on the second side of the semiconductor device and the exposed portion of the second surface of the adhesive tape. A metal heat sink is formed on the thin metal layer. Then, the adhesive tape and the temporary substrate are removed.