The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
May. 20, 2010
Da-jung Chen, Taoyuan County, TW;
Chi-feng Huang, Taipei, TW;
Yi-tsung Chen, Changhua County, TW;
Huei-ren You, Taichung, TW;
Jeng-jen LI, Taipei, TW;
Da-Jung Chen, Taoyuan County, TW;
Chi-Feng Huang, Taipei, TW;
Yi-Tsung Chen, Changhua County, TW;
Huei-Ren You, Taichung, TW;
Jeng-Jen Li, Taipei, TW;
Cyntec Co., Ltd., HsinChu, TW;
Abstract
An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.