The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2016
Filed:
Aug. 18, 2013
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
CYNTEC Co, Ltd., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H01L 23/495 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01); H01L 23/13 (2006.01); H02M 3/00 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H05K 1/021 (2013.01); H05K 7/1432 (2013.01); H01L 23/13 (2013.01); H01L 2224/49175 (2013.01); H02M 3/00 (2013.01); H05K 3/0061 (2013.01); H05K 2201/1034 (2013.01); H05K 2201/10924 (2013.01); H05K 2203/1327 (2013.01);
Abstract
A composite substrate made of a conductive pattern structure mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the conductive pattern structure. Metal lines are used for electrical coupling between the circuitry of the IC chip and the conductive pattern structure. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the conductive pattern structure and good heat distribution from the lead frame.