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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9484290 B1

PDFFull Text
Date of Patent:
Nov. 01, 2016

Filed:

Aug. 18, 2013

Electronic system with a composite substrate

Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Han-Hsiang Lee, Taipei, TW;

Jeng-Jen Li, Taipei, TW;

Kun-Hong Shih, Hsinchu, TW;

Assignee:

CYNTEC Co, Ltd., Hsinchu, TW;

Attorneys:

Min-Lee Teng

Litron Patent & Trademark Office

Primary Examiner:

Hoa C Nguyen

Int. Cl.
CPC ...
H05K 5/02 (2006.01); H01L 23/495 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01); H01L 23/13 (2006.01); H02M 3/00 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H05K 1/021 (2013.01); H05K 7/1432 (2013.01); H01L 23/13 (2013.01); H01L 2224/49175 (2013.01); H02M 3/00 (2013.01); H05K 3/0061 (2013.01); H05K 2201/1034 (2013.01); H05K 2201/10924 (2013.01); H05K 2203/1327 (2013.01);
Abstract

A composite substrate made of a conductive pattern structure mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the conductive pattern structure. Metal lines are used for electrical coupling between the circuitry of the IC chip and the conductive pattern structure. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the conductive pattern structure and good heat distribution from the lead frame.

Find Patent Forward Citations

Lee, Han-Hsiang. (2016). Electronic system with a composite substrate (U.S. Patent No. 9484290). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9484290

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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