Kun-Hong Shih

Title: Kun-Hong Shih: Innovator in Package Structure Technology

Introduction

Kun-Hong Shih is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of package structure technology, holding a total of 5 patents. His innovative work focuses on the combination of device carriers and modifiable substrates, which has implications for various electronic applications.

Latest Patents

One of Kun-Hong Shih's latest patents is titled "Package structure and the method to fabricate thereof." This invention discloses a package structure made from a combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier, and a conductive element is disposed on the substrate. The substrate is placed on the device carrier, with the conductive element located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and the I/O terminals of the first conductive element. Additionally, the invention outlines a method for manufacturing this package structure, allowing for modifications to the conductive pattern in the substrate.

Career Highlights

Kun-Hong Shih is currently associated with Cyntec Company, where he continues to develop innovative solutions in the field of electronics. His work has garnered attention for its practical applications and advancements in technology.

Collaborations

Some of his notable coworkers include Jeng-Jen Li and Kaipeng Chiang, who have collaborated with him on various projects within the company.

Conclusion

Kun-Hong Shih's contributions to package structure technology highlight his role as a leading inventor in the field. His innovative patents and ongoing work at Cyntec Company continue to influence advancements in electronic packaging solutions.