The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2017
Filed:
Feb. 22, 2012
Bau-ru LU, Changhua County, TW;
Jeng-jen LI, Taipei, TW;
Kun-hong Shih, Hsinchu, TW;
Kaipeng Chiang, Taoyuan County, TW;
Bau-Ru Lu, Changhua County, TW;
Jeng-Jen Li, Taipei, TW;
Kun-Hong Shih, Hsinchu, TW;
Kaipeng Chiang, Taoyuan County, TW;
CYNTEC CO., LTD., Hsinchu, TW;
Abstract
The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.