Company Filing History:

4 out of 9,152

Industrial Technology Research Institute

patents

4 out of 1,855

Adeia Semiconductor Bonding Technologies Inc.

patents

Years Active: 2007-2017

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9601474 - Electrically stackable semiconductor wafer and chip packages (2017-03-21),

2. 9059181 - Wafer leveled chip packaging structure and method thereof (2015-06-16),

3. 8587091 - Wafer-leveled chip packaging structure and method thereof (2013-11-19),

4. 8314482 - Semiconductor package device (2012-11-20),

5. 7838333 - Electronic device package and method of manufacturing the same (2010-11-23),

6. 7632707 - Electronic device package and method of manufacturing the same (2009-12-15),

7. 7528009 - Wafer-leveled chip packaging structure and method thereof (2009-05-05),

8. 7294920 - Wafer-leveled chip packaging structure and method thereof (2007-11-13),

Title: Inventor Jeng-Dar Ko - Revolutionizing Technology in Pade, TW

Introduction: Jeng-Dar Ko is a pioneering inventor based in Pade, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Jeng-Dar Ko holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his versatility and ingenuity in creating cutting-edge solutions.

Career Highlights: With a career spanning over two decades, Jeng-Dar Ko has worked with leading tech companies and research institutions, consistently pushing the boundaries of what is possible in the realm of technology.

Collaborations: Throughout his career, Jeng-Dar Ko has collaborated with top engineers, scientists, and designers, fostering a culture of innovation and excellence in all his projects.

Conclusion: Jeng-Dar Ko's relentless pursuit of innovation and his passion for creating transformative technologies have solidified his reputation as a visionary inventor in Pade, Taiwan, and beyond.

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