The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2009
Filed:
Nov. 09, 2005
Shou-lung Chen, Yangmei Township, Taoyuan County, TW;
Ching-wen Hsiao, Banciao, TW;
Yu-hua Chen, Mingjian Shiang, TW;
Jeng-dar Ko, Pade, TW;
Jyh-rong Lin, Tucheng, TW;
Shou-Lung Chen, Yangmei Township, Taoyuan County, TW;
Ching-Wen Hsiao, Banciao, TW;
Yu-Hua Chen, Mingjian Shiang, TW;
Jeng-Dar Ko, Pade, TW;
Jyh-Rong Lin, Tucheng, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.