Jeffrey David Hartman

Title: Innovations of Jeffrey David Hartman

Introduction

Jeffrey David Hartman is a notable inventor based in Severn, MD (US). He has made significant contributions to the field of electronics, particularly in the area of chip bonding technologies. With a total of 12 patents to his name, Hartman's work has advanced the capabilities of multi-chip systems.

Latest Patents

Hartman's latest patents include "Bump structures for low temperature chip bonding" and "Superconducting bump bond electrical characterization." The first patent describes a method for forming a multi-chip system by creating bumps on conductive contact pads of electronic devices and aligning them for effective bonding. The second patent focuses on test structures and methods for verifying the superconductivity of bump bonds that connect superconducting integrated circuit chips. This innovative approach enhances the sensitivity of superconductivity verification, making it highly effective.

Career Highlights

Jeffrey David Hartman is currently employed at Northrop Grumman Systems Corporation, where he continues to push the boundaries of electronic engineering. His work has been instrumental in developing advanced technologies that improve the performance and reliability of electronic systems.

Collaborations

Throughout his career, Hartman has collaborated with talented individuals such as Justin C Hackley and Silai V Krishnaswamy. These partnerships have fostered innovation and contributed to the success of various projects.

Conclusion

Jeffrey David Hartman is a distinguished inventor whose contributions to chip bonding technologies have had a lasting impact on the electronics industry. His innovative patents and collaborative efforts continue to shape the future of electronic systems.