The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 2021
Filed:
Jan. 07, 2019
Aurelius L. Graninger, Sykesville, MD (US);
Joel D. Strand, Ellicott City, MD (US);
Micah John Atman Stoutimore, Kensington, MD (US);
Zachary Kyle Keane, Baltimore, MD (US);
Jeffrey David Hartman, Severn, MD (US);
Justin C. Hackley, Catonsville, MD (US);
Aurelius L. Graninger, Sykesville, MD (US);
Joel D. Strand, Ellicott City, MD (US);
Micah John Atman Stoutimore, Kensington, MD (US);
Zachary Kyle Keane, Baltimore, MD (US);
Jeffrey David Hartman, Severn, MD (US);
Justin C. Hackley, Catonsville, MD (US);
NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);
Abstract
Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.