Catonsville, MD, United States of America

Justin C Hackley

USPTO Granted Patents = 6 

 

 

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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6 patents (USPTO):Explore Patents

Title: Justin C Hackley: Innovator in Superconducting Technology

Introduction

Justin C Hackley is a prominent inventor based in Catonsville, MD (US). He has made significant contributions to the field of superconducting technology, holding a total of 6 patents. His work focuses on innovative solutions that enhance electronic systems and materials.

Latest Patents

One of Hackley's latest patents is the "Superconducting phase-change material switch." This invention includes a switch circuit that features a first superconducting transmission line, a second superconducting transmission line, and a phase-change material switch. The switch is designed to propagate an input signal in one state while blocking it in another, showcasing a novel approach to signal management in superconducting systems.

Another notable patent is for "Bump structures for low temperature chip bonding." This method involves forming bumps on conductive contact pads of electronic devices and aligning them for a bump bonding process. This innovative technique is crucial for creating multi-chip systems that require reliable connections at low temperatures.

Career Highlights

Justin C Hackley is currently employed at Northrop Grumman Systems Corporation, where he continues to develop cutting-edge technologies. His work at this esteemed company allows him to collaborate with other talented professionals in the field.

Collaborations

Some of Hackley's coworkers include Jeffrey David Hartman and Aurelius L Graninger. Their combined expertise contributes to the advancement of innovative technologies within their organization.

Conclusion

Justin C Hackley is a distinguished inventor whose work in superconducting technology has led to several impactful patents. His contributions continue to shape the future of electronic systems and materials.

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