The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2025
Filed:
May. 16, 2022
Justin C. Hackley, Catonsville, MD (US);
Jeffrey David Hartman, Severn, MD (US);
Justin C. Hackley, Catonsville, MD (US);
Jeffrey David Hartman, Severn, MD (US);
NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US);
Abstract
A method of forming a multi-chip system is disclosed. The method includes forming one or more bumps on respective conductive contact pads of a first electronic device, forming one or more mini-bumps on respective conductive contact pads of a second electronic device, and aligning respective one or more mini-bumps with respective one or more bumps. The method further includes performing a bump bonding process that exerts compression force on one or both the first electronic device and the second electronic device to compress the one or more mini-bumps into the one or more bumps to form one or more bump bond structures that bond the second electronic device to the first electronic device.