This inventor holds 1 USPTO granted patent. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2013.
Company Filing History:
Years Active: 2013
Title: Jayby Agno: Innovator in Integrated Circuit Packaging
Introduction
Jayby Agno is a notable inventor based in Singapore, SG. He has made significant contributions to the field of integrated circuit packaging. With a focus on innovative manufacturing methods, Agno has developed a unique approach that enhances the reliability and performance of integrated circuits.
Latest Patents
Agno holds a patent for an "Integrated circuit packaging system with leadframe and method of manufacture thereof." This patent outlines a method of manufacturing an integrated circuit packaging system that includes a leadframe strip system with a stress relief slot. The design ensures that the encapsulation covering the integrated circuit is free of micro-cracks, which is crucial for maintaining the integrity of the device.
Career Highlights
Jayby Agno is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the field of semiconductor packaging. His work has been instrumental in advancing the technology used in integrated circuits, contributing to the overall efficiency and effectiveness of electronic devices.
Collaborations
Agno has collaborated with talented coworkers such as Erwin Aguas Sangalang and Dexter Anonuevo. Their combined expertise has fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Jayby Agno's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in the field. His patent and ongoing work at Stats Chippac Pte. Ltd. highlight his role as a key player in advancing semiconductor technology.