The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Mar. 25, 2010
Jayby Agno, Singapore, SG;
Erwin Aguas Sangalang, Singapore, SG;
Dexter Anonuevo, Singapore, SG;
Ramona Damalerio, Singapore, SG;
Jayby Agno, Singapore, SG;
Erwin Aguas Sangalang, Singapore, SG;
Dexter Anonuevo, Singapore, SG;
Ramona Damalerio, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a leadframe strip system, having a stress relief slot and a leadframe unit, the stress relief slot is at a frame corner of the leadframe strip system and spans adjacent sides of the leadframe unit, the leadframe unit includes a paddle, a tie bar therefrom, and a lead finger; connecting an integrated circuit and the lead finger; forming an encapsulation covering the integrated circuit; and singulating the integrated circuit in the encapsulation from the leadframe strip system with a package corner of the encapsulation free of micro-cracks with an inspection of the package corner at least 50× view.