Stats Chippac Pte. Ltd.

Jayby Agno

Ramona Damalerio

Erwin Aguas Sangalang

Dexter Anonuevo

A method of manufacture of an integrated circuit packaging system includes: providing a leadframe strip system, having a stress relief slot and a leadframe unit, the stress relief slot is at a frame corner of the leadframe strip system and spans adjacent sides of the leadframe unit, the leadframe unit includes a paddle, a tie bar therefrom, and a lead finger; connecting an integrated circuit and the lead finger; forming an encapsulation covering the integrated circuit; and singulating the integrated circuit in the encapsulation from the leadframe strip system with a package corner of the encapsulation free of micro-cracks with an inspection of the package corner at least 50&#xd7; view.

Growing community of inventors

Singapore, Singapore

Jayby Agno