Taoyuan, Taiwan

Jason Chen

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Win Semiconductors Corp.. Active years: 2014-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jason Chen. Retrieved from https://idiyas.com/inventor/jason-chen-qha4qlwc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 3.7

ph-index = 1


Company Filing History:


Years Active: 2014-2017

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2 patents (USPTO):Explore Patents

Title: Jason Chen - Innovator in Semiconductor Technology

Introduction

Jason Chen is a prominent inventor based in Tao Yuan Shien, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to improving semiconductor devices.

Latest Patents

One of Jason's latest patents is titled "Structure of backside copper metallization for semiconductor devices and a fabrication method thereof." This invention presents an improved structure that includes an active layer, a substrate, a backside metal seed layer, a high-temperature sustaining buffer layer, a backside metal layer, and at least one oxidation-resistant layer. The backside metal seed layer contains palladium (Pd) and phosphorus (P), while the high-temperature sustaining buffer layer is made of nickel (Ni), silver (Ag), or nickel alloys. The backside metal layer is composed of copper (Cu). This innovative structure allows semiconductor chips to sustain high-temperature operations effectively.

Another notable patent is the "Electroless plating apparatus and method." This invention is designed specifically for plating semiconductor wafers. The apparatus includes a container, a wafer holder, an electrolyte supplying unit, and an ultrasonic-vibration unit. The container is equipped with at least one inlet for containing the electrolyte. The wafer holder is positioned within the container, and the electrolyte supplying unit delivers the electrolyte through the inlet. The ultrasonic-vibration unit, which consists of at least one frequency ultrasonic transducer, generates a uniform flow of electrolyte, ensuring that wafers, especially those with fine via-holes or trench structures, are uniformly plated.

Career Highlights

Jason Chen is currently employed at Win Semiconductors Corp., where he continues to develop innovative solutions in semiconductor technology. His work has significantly impacted the efficiency and performance of semiconductor devices.

Collaborations

Jason has collaborated with notable colleagues, including Chang-Hwang Hua and Wen Chu, contributing to advancements in their field through teamwork and shared expertise.

Conclusion

Jason Chen is a distinguished inventor whose work in semiconductor technology has led to significant advancements in the industry. His innovative patents reflect his commitment to improving the performance and reliability of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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