James L Oborny

Title: The Innovative Contributions of James L. Oborny

Introduction

James L. Oborny is a notable inventor based in Sachse, Texas. He has made significant contributions to the field of electronics, holding a total of 4 patents. His work primarily focuses on advancements in interposer technology and testing methods for electronic assemblies.

Latest Patents

One of his latest patents is titled "Interposers having cuts through an insulating substrate." This invention involves an interposer that comprises an insulating substrate with a first and second side, featuring a first plurality of metal contacts on one side and a second plurality on the other. The innovation includes a plurality of cuts through the insulating substrate, enhancing the functionality of the interposer.

Another significant patent by Oborny is "Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate." This method allows for topside only dual-side testing of electronic assemblies. It includes a singulated through substrate via (TSV) die that is flip chip attached to a die support, facilitating efficient testing and connections.

Career Highlights

James L. Oborny has built a successful career at Texas Instruments Corporation, where he has been instrumental in developing cutting-edge technologies. His expertise in electronic assembly testing and interposer design has positioned him as a key figure in his field.

Collaborations

Throughout his career, Oborny has collaborated with talented individuals such as Norman Armendariz and Margaret Simmons-Matthews. These partnerships have contributed to the advancement of innovative solutions in electronics.

Conclusion

James L. Oborny exemplifies the spirit of innovation in the electronics industry. His patents and contributions continue to influence the development of advanced technologies.