The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Jun. 07, 2010
Daniel Joseph Stillman, Garland, TX (US);
James L. Oborny, Sachse, TX (US);
William John Antheunisse, Rowlett, TX (US);
Norman J. Armendariz, Plano, TX (US);
Ramyanshu Datta, San Jose, TX (US);
Kenneth M. Butler, Richardson, TX (US);
Margaret Simmons-matthews, Richardson, TX (US);
Daniel Joseph Stillman, Garland, TX (US);
James L. Oborny, Sachse, TX (US);
William John Antheunisse, Rowlett, TX (US);
Norman J. Armendariz, Plano, TX (US);
Ramyanshu Datta, San Jose, TX (US);
Kenneth M. Butler, Richardson, TX (US);
Margaret Simmons-Matthews, Richardson, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method of testing electronic assemblies including singulated TSV die attached to a ML package substrate, on a substrate carrier. The substrate carrier includes through-holes for allowing probe contact to the BGA substrate pads on a bottomside of the package substrate that are coupled to the frontside of the TSVs. Contactable TSV tips on the bottomside of the TSV die are contacted with a topside coupler that includes a pattern of coupling terminals that matches a layout of at least a portion of the TSV tips or pads coupled to the TSV tips. The topside coupler electrically connects pairs of coupling terminals to provide a plurality of TSV loop back paths. The BGA substrate pads are contacted with a plurality of probes tips that extend through the through-holes to couple to the frontside of the TSVs. Electrical testing is performed across the electronic assembly to obtain at least one test parameter.