Ramyanshu Datta

Title: Innovations by Ramyanshu Datta

Introduction

Ramyanshu Datta is an accomplished inventor based in San Jose, CA. He has made significant contributions to the field of electronic assembly testing, holding a total of 3 patents. His work focuses on innovative methods for testing electronic components, particularly through substrate via (TSV) technology.

Latest Patents

One of Ramyanshu's latest patents is titled "Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate." This invention describes a method for topside only dual-side testing of an electronic assembly. It involves providing a singulated TSV die flip chip attached to a die support, which includes a package substrate. The TSVs extend from the frontside to contactable TSV tips on the bottomside. The method allows for dual-side testing across the electronic assembly using first and second topside connections.

Another notable patent is "Through carrier dual side loop-back testing of TSV die after die attach to substrate." This invention outlines a method for testing electronic assemblies that include singulated TSV die attached to a package substrate on a substrate carrier. The substrate carrier features through-holes that allow probe contact to the BGA substrate pads on the bottomside of the package substrate. This method enables electrical testing across the electronic assembly to obtain at least one test parameter.

Career Highlights

Ramyanshu Datta is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of electronic testing. His work has contributed to advancements in the efficiency and effectiveness of electronic assembly testing methods.

Collaborations

Ramyanshu has collaborated with notable coworkers, including Daniel Joseph Stillman and James L. Oborny. Their combined expertise has further enhanced the innovative projects they have undertaken together.

Conclusion

Ramyanshu Datta is a prominent inventor whose work in electronic assembly testing has led to several patents that improve testing methodologies. His contributions continue to shape the future of electronic testing technology.