William John Antheunisse

Title: Innovations of William John Antheunisse

Introduction

William John Antheunisse is an accomplished inventor based in Rowlett, TX (US). He has made significant contributions to the field of electronic assembly testing, holding a total of 3 patents. His work focuses on advanced methods for testing electronic components, particularly through substrate via (TSV) technology.

Latest Patents

Antheunisse's latest patents include innovative methods for dual-side testing of TSV die attached to package substrates. One of his notable patents describes a method of topside only dual-side testing of an electronic assembly. This method involves providing a singulated TSV die flip chip attached to a die support, which includes a package substrate. The TSVs extend from the frontside to contactable tips on the bottomside, allowing for efficient testing through lateral coupling paths. Another significant patent outlines a method for through carrier dual side loop-back testing of TSV die after die attach to substrate. This method utilizes a substrate carrier with through-holes for probe contact, enabling comprehensive electrical testing across the electronic assembly.

Career Highlights

William John Antheunisse is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of electronic testing. His expertise in TSV technology has positioned him as a key contributor to advancements in electronic assembly methodologies.

Collaborations

Throughout his career, Antheunisse has collaborated with notable colleagues, including Daniel Joseph Stillman and James L. Oborny. These collaborations have further enhanced his work and contributed to the development of cutting-edge testing techniques.

Conclusion

William John Antheunisse's contributions to electronic assembly testing through his innovative patents demonstrate his expertise and commitment to advancing technology. His work at Texas Instruments Corporation continues to influence the industry positively.