Location History:
- Dallas, TX (US) (2006 - 2007)
- Garland, TX (US) (2013)
Company Filing History:
Years Active: 2006-2013
Title: The Innovations of Daniel Joseph Stillman
Introduction
Daniel Joseph Stillman is a notable inventor based in Garland, TX (US). He has made significant contributions to the field of electronic assembly testing, holding a total of 4 patents. His work primarily focuses on methods that enhance the efficiency and effectiveness of testing electronic components.
Latest Patents
One of Stillman's latest patents is titled "Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrate." This innovative method involves topside only dual-side testing of an electronic assembly, which includes a singulated through substrate via (TSV) die flip chip attached to a die support. The TSVs extend from the frontside to contactable TSV tips on the bottomside, allowing for efficient testing through embedded topside substrate pads. Another significant patent is "Through carrier dual side loop-back testing of TSV die after die attach to substrate." This method includes testing electronic assemblies with singulated TSV die attached to a package substrate on a substrate carrier, facilitating electrical testing across the assembly to obtain critical test parameters.
Career Highlights
Daniel Joseph Stillman is currently employed at Texas Instruments Corporation, where he continues to innovate and develop new testing methods for electronic assemblies. His expertise in this area has led to advancements that improve the reliability and performance of electronic devices.
Collaborations
Throughout his career, Stillman has collaborated with several talented individuals, including James L. Oborny and William John Antheunisse. These collaborations have contributed to the successful development of his patented technologies.
Conclusion
Daniel Joseph Stillman is a prominent figure in the field of electronic assembly testing, with a strong portfolio of patents that reflect his innovative spirit. His work at Texas Instruments Corporation continues to push the boundaries of technology, ensuring that electronic devices are tested with the highest standards of quality.