James C Matayabas

Title: Innovations by James C Matayabas

Introduction

James C Matayabas is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of microelectronics, particularly in packaging structures. With a total of three patents to his name, Matayabas has demonstrated a commitment to advancing technology in his industry.

Latest Patents

One of Matayabas's latest patents is titled "Package structure to enhance yield of TMI interconnections." This invention describes an apparatus that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are arranged around the semiconductor die on the substrate, each featuring a solid coating that contains a cleaning agent to promote coalescence with other solder balls. The design includes vias formed in the mold compound that expose the solder balls and their respective solid coatings. Additionally, the outer edges of the mold compound may have a smaller thickness than the regions between the vias and the semiconductor die, with micro-channels existing between the solder balls and the mold compound.

Another significant patent by Matayabas is focused on "Methods of forming wafer level underfill materials and structures formed thereby." This patent outlines methods for creating microelectronic packaging structures, including the formation of a wafer level underfill (WLUF) material comprising a resin material. The WLUF material may include additives such