Jena, Germany

Jakob Haarstrich

USPTO Granted Patents = 4 

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2020-2022

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Jakob Haarstrich

Introduction

Jakob Haarstrich is a notable inventor based in Jena, Germany. He has made significant contributions to the field of microscopy, particularly through his innovative methods for analyzing layers on substrates. With a total of 4 patents to his name, Haarstrich continues to push the boundaries of optical technology.

Latest Patents

Haarstrich's latest patents include a method for determining the thickness and refractive index of a layer using a shape feature during analysis. This invention involves imaging the layer through confocal microscopy and determining various parameters such as the apparent thickness and the widening of the point spread function. Another notable patent is a method for generating an overview image using a large aperture objective. This method enhances the depth of field and captures detection radiation to create a comprehensive image of the sample space.

Career Highlights

Jakob Haarstrich is currently employed at Carl Zeiss Microscopy GmbH, a leading company in the field of optical systems. His work focuses on advancing microscopy techniques and improving the accuracy of layer analysis. His innovative approaches have garnered attention in the scientific community and have contributed to the development of new technologies.

Collaborations

Haarstrich collaborates with esteemed colleagues such as Jörg Siebenmorgen and Helge Eggert. Together, they work on various projects aimed at enhancing optical measurement techniques and expanding the capabilities of microscopy.

Conclusion

Jakob Haarstrich's contributions to the field of microscopy through his patents and collaborative efforts highlight his role as an influential inventor. His work continues to inspire advancements in optical technology and layer analysis.

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