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For the Inventor, By the Inventor

San Diego, CA, United States of America

Jaehyun Yeon

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This inventor holds 22 USPTO granted patents and 13 published patent applications, primarily in Antenna Packaging. Top assignee: Qualcomm Incorporated. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jaehyun Yeon. Retrieved from https://idiyas.com/inventor/jaehyun-yeon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 22 

% Patents Active = 95.5

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 13(Granted Patents)


Company Filing History:

goldMedal22 out of 45,060 
 
Qualcomm Incorporated
 patents

Years Active: 2021-2026

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Areas of Expertise:
Hybrid Core Substrate
Embedded Components
Multi-Directional Antenna
High Density Interconnects
Antenna Modules
Fabrication Methods
Millimeter Wave Antenna
Substrate Design
Flexible Interconnects
Asymmetric Antenna
Solder Resist Layer
PCB Antenna
22 patents (USPTO):Explore Patents
1. 12593705 - Hybrid core substrate with embedded components (2026-03-31),
2. 12300873 - Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods (2025-05-13),
3. 12293980 - Package comprising discrete antenna device (2025-05-06),
4. 12126071 - Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods (2024-10-22),
5. 12125742 - Package comprising a substrate with high density interconnects (2024-10-22),
6. 11869833 - Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same (2024-01-09),
7. 11823983 - Package with a substrate comprising pad-on-pad interconnects (2023-11-21),
8. 11764489 - Sub-module L-shaped millimeter wave antenna-in-package (2023-09-19),
9. 11735804 - Multi-core broadband PCB antenna (2023-08-22),
10. 11637057 - Uniform via pad structure having covered traces between partially covered pads (2023-04-25),
11. 11551939 - Substrate comprising interconnects embedded in a solder resist layer (2023-01-10),
12. 11545425 - Substrate comprising interconnects embedded in a solder resist layer (2023-01-03),
13. 11495873 - Device comprising multi-directional antennas in substrates coupled through flexible interconnects (2022-11-08),
14. 11439008 - Package with substrate comprising variable thickness solder resist layer (2022-09-06),
15. 11399435 - Device comprising multi-directional antennas coupled through a flexible printed circuit board (2022-07-26),

Title: The Innovative Journey of Jaehyun Yeon

Introduction: Jaehyun Yeon is a visionary inventor based in San Diego, CA, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Jaehyun Yeon holds several patents in the areas of artificial intelligence, renewable energy, and medical devices, showcasing his diverse range of expertise and creativity.

Career Highlights: With a background in engineering and a passion for problem-solving, Jaehyun Yeon has successfully developed cutting-edge solutions that have revolutionized various industries. His commitment to pushing the boundaries of what is possible has earned him recognition as a leading figure in the world of innovation.

Collaborations: Throughout his career, Jaehyun Yeon has collaborated with top research institutions, universities, and companies to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of numerous projects that have had a lasting impact on society.

Conclusion: Jaehyun Yeon's relentless pursuit of innovation and his dedication to creating a better future through technology make him a true pioneer in his field. His work continues to inspire and shape the world we live in today.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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