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San Diego, CA, United States of America

Jaehyun Yeon

Average Co-Inventor Count = 4.43

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 10

Jaehyun YeonSuhyung Hwang (18 patents)Jaehyun YeonKun Fang (9 patents)Jaehyun YeonHong Bok We (8 patents)Jaehyun YeonChin-Kwan Kim (8 patents)Jaehyun YeonRajneesh Kumar (6 patents)Jaehyun YeonDarryl Sheldon Jessie (4 patents)Jaehyun YeonHyunchul Cho (4 patents)Jaehyun YeonJeahyeong Han (3 patents)Jaehyun YeonMohammad Ali Tassoudji (2 patents)Jaehyun YeonMilind Shah (2 patents)Jaehyun YeonAniket Patil (2 patents)Jaehyun YeonKuiwon Kang (2 patents)Jaehyun YeonTaesik Yang (2 patents)Jaehyun YeonLi-Sheng Weng (1 patent)Jaehyun YeonJeongil Jay Kim (1 patent)Jaehyun YeonXiaoming Chen (1 patent)Jaehyun YeonBoyu Tseng (1 patent)Jaehyun YeonAmeya Galinde (1 patent)Jaehyun YeonJaehyun Yeon (21 patents)Suhyung HwangSuhyung Hwang (19 patents)Kun FangKun Fang (9 patents)Hong Bok WeHong Bok We (80 patents)Chin-Kwan KimChin-Kwan Kim (36 patents)Rajneesh KumarRajneesh Kumar (26 patents)Darryl Sheldon JessieDarryl Sheldon Jessie (19 patents)Hyunchul ChoHyunchul Cho (4 patents)Jeahyeong HanJeahyeong Han (7 patents)Mohammad Ali TassoudjiMohammad Ali Tassoudji (111 patents)Milind ShahMilind Shah (44 patents)Aniket PatilAniket Patil (40 patents)Kuiwon KangKuiwon Kang (28 patents)Taesik YangTaesik Yang (13 patents)Li-Sheng WengLi-Sheng Weng (19 patents)Jeongil Jay KimJeongil Jay Kim (11 patents)Xiaoming ChenXiaoming Chen (5 patents)Boyu TsengBoyu Tseng (1 patent)Ameya GalindeAmeya Galinde (1 patent)
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Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Qualcomm Incorporated (21 from 41,326 patents)


21 patents:

1. 12300873 - Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods

2. 12293980 - Package comprising discrete antenna device

3. 12126071 - Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods

4. 12125742 - Package comprising a substrate with high density interconnects

5. 11869833 - Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same

6. 11823983 - Package with a substrate comprising pad-on-pad interconnects

7. 11764489 - Sub-module L-shaped millimeter wave antenna-in-package

8. 11735804 - Multi-core broadband PCB antenna

9. 11637057 - Uniform via pad structure having covered traces between partially covered pads

10. 11551939 - Substrate comprising interconnects embedded in a solder resist layer

11. 11545425 - Substrate comprising interconnects embedded in a solder resist layer

12. 11495873 - Device comprising multi-directional antennas in substrates coupled through flexible interconnects

13. 11439008 - Package with substrate comprising variable thickness solder resist layer

14. 11399435 - Device comprising multi-directional antennas coupled through a flexible printed circuit board

15. 11258165 - Asymmetric antenna structure

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12/4/2025
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