The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Mar. 05, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Jeahyeong Han, San Diego, CA (US);

Rajneesh Kumar, San Diego, CA (US);

Suhyung Hwang, Rancho Mission Viejo, CA (US);

Jaehyun Yeon, San Diego, CA (US);

Mohammad Ali Tassoudji, San Diego, CA (US);

Darryl Sheldon Jessie, San Diego, CA (US);

Ameya Galinde, San Diego, CA (US);

Assignee:

Qualcomm Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01Q 1/36 (2006.01); H01Q 1/52 (2006.01); H05K 1/18 (2006.01); H05K 9/00 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01Q 1/36 (2013.01); H01Q 1/526 (2013.01); H05K 1/185 (2013.01); H05K 9/0081 (2013.01); H01L 21/4857 (2013.01); H01L 24/16 (2013.01); H01L 25/165 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.


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