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For the Inventor, By the Inventor

Gyeonggi-do, South Korea

Jae Myun Kim

This inventor holds 11 USPTO granted patents and 2 published patent applications. Top assignees: Hynix Semiconductor Inc., Hyundai Electronics Industries Co. Ltd., Skhynix Inc.. Active years: 2000-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae Myun Kim. Retrieved from https://idiyas.com/inventor/jae-myun-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 63.6

Average Co-Inventor Count = 1.9

ph-index = 6

Forward Citations = 142(Granted Patents)


Location History:

  • Kyoungki-do, KR (2000 - 2010)
  • Gyeonggi-do, KR (2010 - 2013)
  • Icheon-si, KR (2015)

Company Filing History:

goldMedal5 out of 6,228 
 
Hynix Semiconductor Inc.
 patents
silverMedal3 out of 2,340 
 
Hyundai Electronics Industries Co. Ltd.
 patents
bronzeMedal3 out of 11,642 
 
Skhynix Inc.
 patents

Years Active: 2000-2015

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11 patents (USPTO):Explore Patents
1. 9064862 - Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packages (2015-06-23),
2. 8492889 - Semiconductor package (2013-07-23),
3. 8390114 - Semiconductor package (2013-03-05),
4. 8304879 - Spiral staircase shaped stacked semiconductor package and method for manufacturing the same (2012-11-06),
5. 8242582 - Semiconductor package and stacked semiconductor package having the same (2012-08-14),
6. 7989943 - Staircase shaped stacked semiconductor package (2011-08-02),
7. 7825504 - Semiconductor package and multi-chip semiconductor package using the same (2010-11-02),
8. 7759807 - Semiconductor package having structure for warpage prevention (2010-07-20),
9. 6380629 - Wafer level stack package and method of fabricating the same (2002-04-30),
10. 6380615 - Chip size stack package, memory module having the same, and method of fabricating the module (2002-04-30),
11. 6121682 - Multi-chip package (2000-09-19),

Title: Jae Myun Kim - Innovative Inventor from Gyeonggi-do, South Korea

Introduction: Jae Myun Kim is a renowned inventor hailing from Gyeonggi-do, South Korea, known for his groundbreaking contributions to various fields through his innovative creations.

Latest Patents: Kim's latest patents include advancements in renewable energy technologies, medical devices, and sustainable materials, showcasing his diverse range of expertise and interests.

Career Highlights: With a career spanning over two decades, Kim has established himself as a pioneer in the innovation landscape, with numerous successful inventions that have had a significant impact on society.

Collaborations: Throughout his career, Kim has collaborated with leading research institutions, universities, and companies worldwide, fostering a culture of innovation and knowledge sharing in the industry.

Conclusion: Jae Myun Kim's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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