The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2010
Filed:
Sep. 10, 2007
Applicant:
Jae Myun Kim, Gyeonggi-do, KR;
Inventor:
Jae Myun Kim, Gyeonggi-do, KR;
Assignee:
Hynix Semiconductor Inc., Kyoungki-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a semiconductor package and a multi-chip semiconductor package. The semiconductor package includes a semiconductor chip having bonding pads located at a center portion thereof; redistribution patterns extending from the bonding pads toward one edge of the semiconductor chip; and dummy bump pads located adjacent to another edge of the semiconductor chip which is opposite the one edge.