The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
May. 29, 2007
Han Jun Bae, Kyoungki-do, KR;
Jae Myun Kim, Kyoungki-do, KR;
Han Jun Bae, Kyoungki-do, KR;
Jae Myun Kim, Kyoungki-do, KR;
Hynix Semiconductor Inc., Kyoungki-do, KR;
Abstract
A semiconductor package includes a substrate having a plurality of connection pads and a plurality of ball lands; a semiconductor chip attached to one surface of the substrate and having a plurality of bonding pads that are connected to the respective connection pads of the substrate; a first molding structure covering an upper surface of the substrate including a connection region between the bonding pads and the connection pads and the semiconductor chip; a second molding structure formed adjacent to an edge of the lower surface of the substrate; and a plurality of solder balls attached to the respective ball lands of the substrate.