The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Aug. 01, 2012
Applicants:

IN Chul Hwang, Icheon-si, KR;

Jae Myun Kim, Icheon-si, KR;

Seung Jee Kim, Seongnam-si, KR;

Jin Su Lee, Seoul, KR;

Inventors:

In Chul Hwang, Icheon-si, KR;

Jae Myun Kim, Icheon-si, KR;

Seung Jee Kim, Seongnam-si, KR;

Jin Su Lee, Seoul, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 25/00 (2006.01); H01L 21/768 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48227 (2013.01); H01L 21/76898 (2013.01); H01L 2924/10253 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/80 (2013.01); H01L 25/0657 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/9222 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2224/80896 (2013.01); H01L 2924/12041 (2013.01); H01L 2224/0401 (2013.01);
Abstract

Dual-layered structural semiconductor chips are provided. The semiconductor chip includes a first semiconductor chip and a second semiconductor chip bonded to the first semiconductor chip. The first semiconductor chip includes a first substrate having a first bottom surface. The second semiconductor chip includes a second substrate having a second bottom surface. The first bottom surface directly contacts the second bottom surface. The related packages and the related methods are also provided.


Find Patent Forward Citations

Loading…