Location History:
- Seoul, KR (2010)
- Suwon, KR (2015)
- Suwon-Si, KR (2019 - 2020)
- Suson-Si, KR (2020)
Company Filing History:
5 out of 131,611 
4 out of 7,593 Years Active: 2010-2020
Title: The Innovative Contributions of Jae Kul Lee
Introduction
Jae Kul Lee is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of nine patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.
Latest Patents
One of Jae Kul Lee's latest patents is a semiconductor package that includes a connection structure, a semiconductor chip, and an encapsulant. The connection structure features an insulating layer, a redistribution layer, and a connection via that penetrates through the insulating layer. The semiconductor chip has an active surface with connection pads and an inactive surface opposing it. The encapsulant covers part of the semiconductor chip, which includes a groove formed in the active surface and a dam structure surrounding the groove. Another notable patent is the fan-out sensor package, which consists of a redistribution portion with a through-hole, a first semiconductor chip with a sensing region, and a second semiconductor chip. This innovative design allows for efficient electrical connections and encapsulation of the components.
Career Highlights
Jae Kul Lee has worked with leading companies in the electronics industry, including Samsung Electronics Co., Ltd. and Samsung Electro-Mechanics Co., Ltd. His experience in these organizations has allowed him to develop cutting-edge technologies that have advanced the semiconductor field.
Collaborations
Throughout his career, Jae Kul Lee has collaborated with talented individuals such as Ha Yong Jung and Sung Taek Woo. These partnerships have contributed to the successful development of his innovative patents.
Conclusion
Jae Kul Lee's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in electronics and semiconductor packaging.