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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10741498 B1

PDFFull Text
Date of Patent:
Aug. 11, 2020

Filed:

Mar. 19, 2019

Semiconductor package

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yu Seon Heo, Suwon-si, KR;

Jae Kul Lee, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Nathan W Ha

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/48 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/5383 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 25/0652 (2013.01); H01L 25/18 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01);
Abstract

A semiconductor package includes: a first structure including a plurality of stacked first semiconductor chips and electrically connected to a first redistribution layer through connection vias having different heights; and a second structure including a second semiconductor chip electrically connected to a second redistribution layer. The first and second redistribution layers are electrically connected to each other through an electrical connection member formed on the second structure.

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Heo, Yu. (2020). Semiconductor package (U.S. Patent No. 10741498). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10741498

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