The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2019
Filed:
May. 22, 2018
Samsung Electronics Co., Ltd., Suwon-si, KR;
Ha Yong Jung, Suwon-Si, KR;
Jae Min Choi, Suwon-Si, KR;
Jae Kul Lee, Suwon-Si, KR;
Dong Jin Kim, Suwon-Si, KR;
Sung Taek Woo, Suwon-Si, KR;
Ji Hye Shim, Suwon-Si, KR;
Woon Ha Choi, Suwon-Si, KR;
Han Sang Cho, Suwon-Si, KR;
SAMSUNG ELECTRONICS CO, LTD., Suwon-si, KR;
Abstract
A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.