Jae Doo Kwon

This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignees: Amkor Technology Singapore Holding Pte. Ltd., Amkor Technology, Inc.. Active years: 2015-2024.

USPTO Granted Patents = 6 (Patent Applications = 1)

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 10(Granted Patents)

Company Filing History:

3 out of 326

Amkor Technology Singapore Holding Pte. Ltd.

patents

3 out of 1,009

Amkor Technology, Inc.

patents

Years Active: 2015-2024

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12062588 - Semiconductor package having routable encapsulated conductive substrate and method (2024-08-13),

2. 11508635 - Semiconductor package having routable encapsulated conductive substrate and method (2022-11-22),

3. 10685897 - Semiconductor package having routable encapsulated conductive substrate and method (2020-06-16),

4. 10049954 - Semiconductor package having routable encapsulated conductive substrate and method (2018-08-14),

5. 9633932 - Lead frame package having discharge hole and method of manufacturing the same (2017-04-25),

6. 9054089 - Lead frame package having discharge holes and method of manufacturing the same (2015-06-09),

I specialize in innovations, inventions, inventors, patent attorneys, assignees, and patents.

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1 patent pending:

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