The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Jul. 23, 2013
Amkor Technology, Inc., Chandler, AZ (US);
Kyoung Yeon Lee, Gyeonggi-do, KR;
Byong Jin Kim, Gyeonggi-do, KR;
Kyung Su Kim, Gyeonggi-do, KR;
Hyung Il Jeon, Gyeonggi-do, KR;
Jae Doo Kwon, Seoul, KR;
Amkor Technology, Inc., Tempe, AZ (US);
Abstract
In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip. One or more discharge holes are formed on and extending through one or more specific leads and/or on and extending through a predetermined position of the die paddle. The discharge holes are configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the packaged electronic chip.