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For the Inventor, By the Inventor

Boise, ID, United States of America

J Neil Greeley

USPTO Granted Patents = 11

Average Co-Inventor Count = 2.4

ph-index = 4

Forward Citations = 214(Granted Patents)


Company Filing History:

goldMedal11 out of 37,920 
 
Micron Technology Incorporated
 patents

Years Active: 2012-2020

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11 patents (USPTO):Explore Patents
1. 10629671 - Methods of forming semiconductor device structures, and methods of forming capacitor structures (2020-04-21),
2. 10090376 - Methods of forming semiconductor device structures, and methods of forming capacitor structures (2018-10-02),
3. 9768021 - Methods of forming semiconductor device structures including metal oxide structures (2017-09-19),
4. 9276059 - Semiconductor device structures including metal oxide structures (2016-03-01),
5. 9175217 - Wet etchants including at least one fluorosurfactant etch blocker (2015-11-03),
6. 9005473 - Gaseous compositions comprising hydrogen fluoride and an alkylated ammonia derivative (2015-04-14),
7. 8729002 - Wet etchants including at least one etch blocker (2014-05-20),
8. 8669645 - Semiconductor structures including polymer material permeated with metal oxide (2014-03-11),
9. 8252194 - Methods of removing silicon oxide (2012-08-28),
10. 8153019 - Methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices (2012-04-10),
11. 8097175 - Method for selectively permeating a self-assembled block copolymer, method for forming metal oxide structures, method for forming a metal oxide pattern, and method for patterning a semiconductor structure (2012-01-17),

Title: J Neil Greeley: Innovator in Semiconductor Technology

Introduction

J Neil Greeley is a prominent inventor based in Boise, ID (US), known for his significant contributions to semiconductor technology. With a total of 11 patents to his name, Greeley has made remarkable advancements in the field, particularly in methods of forming semiconductor device structures and capacitor structures.

Latest Patents

Greeley's latest patents focus on innovative methods for forming semiconductor device structures. One of his notable inventions involves creating a mold template with trenches within a mold material. This process allows for the formation of structures within the trenches, followed by a wet removal process to eliminate the mold template. A liquid material remains in the spaces between adjacent structures after this process. Subsequently, a polymer material is formed in these spaces, and a dry removal process is performed to remove the polymer material. These methods enhance the efficiency and effectiveness of semiconductor device manufacturing.

Career Highlights

Throughout his career, Greeley has been associated with Micron Technology Incorporated, where he has played a vital role in advancing semiconductor technologies. His work has not only contributed to the company's success but has also had a lasting impact on the industry as a whole.

Collaborations

Greeley has collaborated with several talented individuals in his field, including Dan B Millward and Timothy A Quick. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in semiconductor manufacturing.

Conclusion

J Neil Greeley's contributions to semiconductor technology through his patents and collaborations highlight his status as a leading inventor in the field. His innovative methods continue to shape the future of semiconductor device structures and capacitor technologies.

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