Company Filing History:
Years Active: 2009-2011
Title: The Innovations of Isao Tsuchiya
Introduction
Isao Tsuchiya is a notable inventor based in Ibi-gun, Japan. He has made significant contributions to the field of solder ball loading technology, with a focus on enhancing the efficiency and precision of electronic component assembly. With a total of 2 patents to his name, Tsuchiya's work is recognized for its innovative approach to solving complex engineering challenges.
Latest Patents
One of Tsuchiya's latest patents is the "Solder ball loading method and solder ball loading unit." This invention is designed to facilitate the loading of solder balls onto connection pads of printed wiring boards. The solder ball loading unit features a ball arranging mask with multiple openings that correspond to the connection pads. A cylinder member is positioned above the mask to gather solder balls by sucking air from the openings. The moving mechanism allows the cylinder member to move horizontally, enabling the gathered solder balls to roll on the mask and drop onto the connection pads through the openings.
Career Highlights
Throughout his career, Isao Tsuchiya has been associated with Ibiden Company Limited, where he has contributed to various projects aimed at improving electronic manufacturing processes. His innovative designs have played a crucial role in advancing soldering techniques, which are essential for the production of reliable electronic devices.
Collaborations
Tsukiya has worked alongside talented colleagues, including Atsunori Sumita and Yoichiro Kawamura. Their collaborative efforts have led to the development of cutting-edge technologies that enhance the efficiency of solder ball loading systems.
Conclusion
Isao Tsuchiya's contributions to the field of solder ball loading technology exemplify the spirit of innovation in engineering. His patents reflect a commitment to improving manufacturing processes, making a lasting impact on the electronics industry.