The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Dec. 04, 2008
Atsunori Sumita, Ibi-gun, JP;
Yoichiro Kawamura, Ibi-gun, JP;
Shigeki Sawa, Ibi-gun, JP;
Katsuhiko Tanno, Ibi-gun, JP;
Isao Tsuchiya, Ibi-gun, JP;
Yoshiyuki Mabuchi, Ogaki, JP;
Osamu Kimura, Ogaki, JP;
Atsunori Sumita, Ibi-gun, JP;
Yoichiro Kawamura, Ibi-gun, JP;
Shigeki Sawa, Ibi-gun, JP;
Katsuhiko Tanno, Ibi-gun, JP;
Isao Tsuchiya, Ibi-gun, JP;
Yoshiyuki Mabuchi, Ogaki, JP;
Osamu Kimura, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A solder ball loading unit for loading a solder balls to be turned to a solder bumps on a connection pad of a printed wiring board, including a ball arranging mask having a plurality of openings corresponding to the connection pad of the printed wiring board, a cylinder member located above the ball arranging mask for gathering the solder balls just below the opening portion by sucking air from the opening portion, and a moving mechanism for moving the cylinder member in the horizontal direction, the moving mechanism moving the solder balls gathered on the ball arranging mask by moving the cylinder member and dropping the solder balls onto the connection pads of the printed wiring board through the opening in the ball arranging mask.