The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2009
Filed:
Mar. 09, 2006
Atsunori Sumita, Ibi-gun, JP;
Yoichiro Kawamura, Ibi-gun, JP;
Shigeki Sawa, Ibi-gun, JP;
Katsuhiko Tanno, Ibi-gun, JP;
Isao Tsuchiya, Ibi-gun, JP;
Yoshiyuki Mabuchi, Ogaki, JP;
Osamu Kimura, Ogaki, JP;
Atsunori Sumita, Ibi-gun, JP;
Yoichiro Kawamura, Ibi-gun, JP;
Shigeki Sawa, Ibi-gun, JP;
Katsuhiko Tanno, Ibi-gun, JP;
Isao Tsuchiya, Ibi-gun, JP;
Yoshiyuki Mabuchi, Ogaki, JP;
Osamu Kimura, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
Provides a solder ball loading unit capable of loading fine solder balls on electrodes. Solder ballsare gathered by sucking air from a loading cylinderlocated above a ball arranging mask. The gathered solder ballsare rolled on the ball arranging maskby moving the loading cylinderin a horizontal direction and the solder ballsare dropped onto the electrodeson a multilayer printed wiring boardthrough an openingsin the ball arranging mask