This inventor holds 1 USPTO granted patent. Top assignees: Hitachi Hokkai Semiconductor Ltd., Renesas Technology Corp.. Active years: 2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 2005
Title: Isao Seki: Innovator in Semiconductor Technology
Introduction
Isao Seki is a notable inventor based in Ebina, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and methods.
Latest Patents
One of his key patents is for a semiconductor device and method of manufacturing the same. This invention features a semiconductor chip with a quadrangle main surface, a wiring substrate, and a resin seal member that effectively seals the semiconductor chip. The design includes a gate cut trace portion on a side face extending along a first side of the resin seal member. Notably, the sectional area between the main surface of the wiring substrate and the resin seal member is smaller than that between the semiconductor chip and the resin seal member.
Career Highlights
Isao Seki has worked with prominent companies in the semiconductor industry, including Renesas Technology Corporation and Hitachi Hokkai Semiconductor Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technology.
Collaborations
Throughout his career, Seki has collaborated with talented individuals such as Hiroshi Arai and Nobuaki Nagashima. These partnerships have fostered innovation and development in his projects.
Conclusion
Isao Seki's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to impact the field positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile