The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2005
Filed:
Mar. 07, 2002
Hiroshi Arai, Yamato, JP;
Nobuaki Nagashima, Yamato, JP;
Norihiko Kasai, Sagamihara, JP;
Isao Seki, Ebina, JP;
Hiroshi Arai, Yamato, JP;
Nobuaki Nagashima, Yamato, JP;
Norihiko Kasai, Sagamihara, JP;
Isao Seki, Ebina, JP;
Renesas Technology Corp., Tokyo, JP;
Hitachi Hokkai Semiconductor, Ltd., Hokkaido, JP;
Abstract
A semiconductor chip has a quadrangle main surface, a wiring substrate, and a resin seal member for sealing the semiconductor chip, in which the resin seal member has a quadrangle main surface which confronts the main surface of the semiconductor chip. A gate cut trace portion is formed on a side face extending along a first side of the main surface of the resin seal member. A sectional area of an area between the main surface of the wiring substrate and the main surface of the resin seal member at a position outside a side face of the semiconductor chip is smaller than a sectional area of an area between the main surface of the semiconductor chip and the main surface of the resin seal member.