Nirasaki, Japan

Isamu Sakuragi


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2011-2014

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3 patents (USPTO):

Title: Innovations of Isamu Sakuragi

Introduction

Isamu Sakuragi is a notable inventor based in Nirasaki, Japan. He has made significant contributions to the field of substrate processing, holding a total of three patents. His work focuses on advanced methods and devices that enhance the efficiency and effectiveness of substrate processing.

Latest Patents

Sakuragi's latest patents include a bevel/backside polymer removing method and device, as well as a substrate processing apparatus and storage medium. The bevel/backside polymer removing method is designed to eliminate multi-layered bevel/backside polymers that adhere to the bevel surface and backside of a target substrate. This method involves mechanically destroying the polymers and heating the residues left behind. The substrate processing method includes preparing a substrate with a low-k interlayer dielectric film and a photoresist film, which serves as an etching mask. The process involves etching the low-k interlayer insulating film, ashing the photoresist film using hydrogen radicals, and recovering any damage to the low-k interlayer insulating film through the application of a specific recovery gas.

Career Highlights

Sakuragi is currently employed at Tokyo Electron Limited, a leading company in the semiconductor manufacturing equipment industry. His innovative approaches have contributed to the advancement of substrate processing technologies, making significant impacts in the field.

Collaborations

He has collaborated with notable coworkers, including Kazuhiro Kubota and Akinori Kitamura, to further enhance the development of his patented technologies.

Conclusion

Isamu Sakuragi's contributions to substrate processing through his innovative patents demonstrate his expertise and commitment to advancing technology in this field. His work continues to influence the industry and pave the way for future innovations.

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