The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Nov. 11, 2008
Bevel/backside polymer removing method and device, substrate processing apparatus and storage medium
Applicants:
Isamu Sakuragi, Nirasaki, JP;
Akinori Kitamura, Nirasaki, JP;
Tsutomu Hiroki, Nirasaki, JP;
Takehiro Shindo, Nirasaki, JP;
Inventors:
Isamu Sakuragi, Nirasaki, JP;
Akinori Kitamura, Nirasaki, JP;
Tsutomu Hiroki, Nirasaki, JP;
Takehiro Shindo, Nirasaki, JP;
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 1/00 (2006.01); B24B 37/34 (2012.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02087 (2013.01); B24B 37/345 (2013.01); H01L 21/0209 (2013.01); H01L 21/67046 (2013.01); H01L 21/67115 (2013.01); H01L 21/67069 (2013.01); H01L 21/67207 (2013.01); Y10S 134/902 (2013.01);
Abstract
A bevel/backside polymer removing method removes multi-layered bevel/backside polymers adhering to a bevel surface and a backside of a target substrate. The multi-layered bevel/backside polymers include an inorganic layer and an organic layer. The bevel/backside polymer removing method includes mechanically destroying the multi-layered bevel/backside polymers and heating residues of the multi-layered bevel/backside polymers mechanically destroyed.