Roseville, CA, United States of America

Iqbal Rajwani

This inventor holds 31 USPTO granted patents and 4 published patent applications and 1 EPO patent, primarily in System-On-Chip Architecture. Top assignee: Intel Corporation. Active years: 2006-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Iqbal Rajwani. Retrieved from https://idiyas.com/inventor/iqbal-rajwani

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 90.3

 

Average Co-Inventor Count = 6.3

ph-index = 5

Forward Citations = 90(Granted Patents)


Company Filing History:


Years Active: 2006-2025

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Areas of Expertise:
SRAM Arrays
Chiplet Configurations
Energy Efficient Memory
Dynamic Power Budget
Memory Array Segmentation
Low-Power Clock Gate
Register File Aging
Power Switching Circuitry
Integrated Clock Gate
Assist Circuit
31 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Iqbal Rajwani in Semiconductor Technology

Introduction

Iqbal Rajwani, a prominent inventor based in Roseville, CA, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 30 patents, his work focuses on innovative chiplet configurations and system-on-chip architecture disaggregation, which have the potential to revolutionize the way integrated circuits are manufactured and utilized.

Latest Patents

Iqbal's latest patents include groundbreaking methods for enabling product SKUs based on chiplet configurations. His innovative approach introduces a disaggregated processor package that allows for the interchangeability of chiplets. This design specifies a standard physical interconnect for chiplets, facilitating their ability to interface with a fabric or bridge interconnect. The technology promotes a seamless integration of chiplets from different IP designers, making them interchangeable during assembly. Additionally, Iqbal's patent addresses the transmission of data across an inter-chiplet fabric using encapsulation, which renders the transferred data opaque to the fabric, further supporting the interchangeability of chiplets. Another notable patent focuses on the disaggregation of system-on-chip (SoC) architecture, offering techniques to integrate multiple distinct chiplets into a common chassis. This innovation enables a diverse set of chiplets, including graphics processing units or parallel processors, to be assembled into a single device, marking a significant advancement in semiconductor design.

Career Highlights

Iqbal Rajwani currently works for Intel Corporation, where he contributes to pioneering technologies that push the boundaries of semiconductor innovation. His extensive experience in the industry has allowed him to develop a robust portfolio that showcases his commitment to advancing chip technology and improving integration processes.

Collaborations

Throughout his career, Iqbal has had the opportunity to collaborate with esteemed colleagues including Altug Koker and Bhushan M Borole. These collaborations have not only enhanced his projects but have also fostered a culture of teamwork and innovation within Intel Corporation.

Conclusion

Iqbal Rajwani's contributions to the semiconductor industry underscore the importance of innovation in technology. With a record of 30 patents and groundbreaking concepts in chiplet configurations, his work at Intel Corporation is paving the way for future advancements in integrated circuit design. His collaborative spirit and commitment to research continue to inspire both colleagues and aspiring inventors in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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