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Company Filing History:
Years Active: 2002-2008
Title: Iosif R. Korsunsky: Innovator in High-Density Connector Technology
Introduction: Iosif R. Korsunsky is a prominent inventor based in Harrisburg, Pennsylvania, with an impressive record of 62 patents to his name. His contributions primarily lie in the field of electrical connectors, where he has developed innovative solutions that enhance performance and efficiency in various applications.
Latest Patents: Among Korsunsky's latest patents are groundbreaking inventions such as the high-density, high-speed connector and a pluggable connector with a high-density structure. The high-density, high-speed connector features a housing and conductive contacts positioned to optimize space and functionality. This design includes a retaining tab that ensures stability and protects the housing from displacement on the mounted board. Similarly, the pluggable connector comprises a dielectric housing and multiple sub-assemblies, meticulously designed to enhance performance by utilizing rows of partitions and ribs, thereby creating a robust structure.
Career Highlights: Iosif R. Korsunsky has made significant strides in his career at Hon Hai Precision Industry Co., Ltd., a leader in manufacturing and technology. His innovative designs have not only contributed to the company's growth but have also set new standards in the connector industry.
Collaborations: Throughout his career, Korsunsky has collaborated with talented colleagues, including Kevin E. Walker and Tod M. Harlan. Their partnerships have resulted in cutting-edge technologies that drive advancements in electrical connector designs, reflecting a strong team dynamic focused on innovation.
Conclusion: Iosif R. Korsunsky continues to be a driving force in the development of advanced connector technologies. With numerous patents and a commitment to pushing the boundaries of engineering, he is well-positioned to influence the future of electrical connectivity. His work at Hon Hai Precision Industry Co., Ltd. underscores his role as a key player in the ongoing evolution of high-density connector solutions.
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