Ilseok Son

Title: Ilseok Son: Semiconductor Bonding and Patent Innovation.

Introduction

Ilseok Son is an inventor based in Albany, New York, whose patent work includes methods for evaluating bonded semiconductor wafers. He is associated with Tokyo Electron Limited and has 3 patents.

Latest Patents

Son’s latest patent, “Torsional Shear Testing for Semiconductor Surface Bonds,” describes a method for measuring the bonding energy of a bonded wafer. The method inserts a blade between two bonded wafers to create a crack that extends from the blade’s contact point to an area where the wafers remain bonded. Light beams pass through the crack at the wafer’s outer edge, and a detector collects the transmitted light. The bonding energy is then determined from the intensity of the collected light.

Career Highlights

Son’s patent portfolio reflects work on semiconductor bonding and measurement techniques. His disclosed method uses optical measurements to assess the strength of a wafer bond.

Collaborations

Son is associated with Tokyo Electron Limited. Andrew Tuchman is identified as his coworker.

Conclusion

Ilseok Son’s patent work addresses the practical challenge of measuring semiconductor wafer bonding energy, contributing a light-based approach to evaluating bonded surfaces.