The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Mar. 26, 2024
Tokyo Electron Limited, Tokyo, JP;
Andrew Tuchman, Albany, NY (US);
Ilseok Son, Albany, NY (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method of determining a bonding energy of a bonded wafer includes receiving the bonded wafer including a first wafer bonded with a second wafer, and inserting a blade between the first wafer and the second wafer to form a crack between the first wafer and the second wafer, the crack extending from a portion of the blade contacting the first wafer and the second wafer to a point where the first wafer and the second wafer are still bonded. The method further includes passing light beams through the crack at an outer edge of the bonded wafer, and collecting light beams transmitting through the crack at a light detector. And the method further includes determining the bonding energy of the bonded wafer based on a light intensity of the collected light beams.