Ichiro Yagi

Title: Ichiro Yagi: Innovator in MEMS Technology

Introduction

Ichiro Yagi is a prominent inventor based in Hong Kong, China, known for his significant contributions to the field of Micro-Electro-Mechanical Systems (MEMS). With a total of nine patents to his name, Yagi has made remarkable advancements in MEMS packaging and solder joint technology. His innovative work has garnered attention in the electronics industry.

Latest Patents

Yagi's latest patents include a MEMS package and a method of manufacturing the same. This MEMS package features a MEMS chip adhered to a package substrate. The MEMS chip contains an element substrate where a movable element is formed. Notably, the MEMS package incorporates a particle filter, which is designed with a pierced structure that includes multiple through holes arranged regularly. The particle filter achieves a plane-opening rate of at least 45% and a thickness-opening rate of at least 50%. Another significant patent is a surface treatment method for solder joints. This method utilizes an alkali buffer solution to treat the solder joint, resulting in a passive layer that prevents corrosion and enhances the reliability of electronic products.

Career Highlights

Throughout his career, Ichiro Yagi has worked with notable companies such as Sae Magnetics (H.K.) Limited and TDK Corporation. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the electronics sector.

Collaborations

Yagi has collaborated with esteemed colleagues, including Masashi Shiraishi and Takehiro Kamigama. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Ichiro Yagi's contributions to MEMS technology and solder joint methods highlight his role as a leading inventor in the electronics industry. His innovative patents and collaborations reflect his commitment to advancing technology and improving product reliability.