Sae Magnetics (h.k.) Limited

Tdk Corporation

Ichiro Yagi

Masashi Shiraishi

Takehiro Kamigama

Toyotaka Kobayashi

Hironobu Hayashi

Hiroyoshi Nakajima

Bing Ma

Quansheng Wu

DeFeng Lu

Binhua Tan

XiaoGang Yang

DeYu He

A MEMS package has a MEMS chip, and a package substrate which the MEMS chip is adhered. The MEMS chip has an element substrate which a movable element is formed. The MEMS package has a particle filter formed on the package substrate or the MEMS chip. The particle filter has a pierced-structure, which plural through holes are formed on a base surface by a regular arrangement. Further, in the particle filter, a plane-opening rate is set at least 45%, and a thickness-opening rate is set at least 50%.

MEMS package and method of manufacturing the same

A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint.

Surface treatment method for solder joint

A suspension includes a flexure constituted by a metal plate member, for supporting a head slider provided with at least one head element, a load beam provided with a top end section and constituted by a metal plate member, for supporting the flexure at the top end section, and an individual FPC member attached to the flexure and the load beam and provided with trace conductors to be electrically connected to the at least one head element of the head slider. The FPC member includes a plurality of via holes provided with metal fillers filled therein, the metal fillers in the respective via holes are welded to the flexure and/or the load beam, and the FPC member is fixed to the flexure and/or the load beam at least by means of the welding.

FPC with via holes with filler being welded to suspension and drive apparatus

A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in typical anistropic bonding to ensure durable bonding. At the same time, these structures also allow for reworkability under which the bonded parts can be separated easily.

Bonding structure for a hard disk drive suspension using anisotropic conductive film

A system and a method for bonding a slider to a suspension tongue are disclosed. A set of conductive fibers is embedded in a bonding adhesive binding the slider to the suspension tongue to improve conductivity between the slider and the suspension assembly. The bonding adhesive includes binder resin and silver powder. The slider is composed of aluminum oxide and titanium carbide. The set of conductive fibers is composed of carbon coated potassium titanic acid whisker. The set of conductive fibers range in length from 10 &#x3bc;m to 20 &#x3bc;m, and in diameter from 0.3 &#x3bc;m to 0.6 &#x3bc;m. The set of conductive fibers range in resistance from 0.01 ohm to 0.1 ohm. The set of conductive fibers is mixed with the bonding adhesive in a 1% to 4% mixing ratio.

Conductive adhesive for magnetic head assembly

A connecting portion of the external side FPC board connected to a control circuit provided outside of a magnetic head assembly and connecting terminals of arm side FPC boards respectively connected to magnetic heads are overlapped with an anisotropic conductive tape having anisotropic conductivity in the direction of thickness in between. The anisotropic conductive tape is applied pressure between the connecting portion and the connecting terminals with heating to a temperature of, for example, 150&deg; C. and is set. As a result, the connecting portion and the connecting terminals are connected. The anisotropic conductive tape has anisotropic conductivity only in the direction of thickness so that conduction of wirings adjacent each other is prevented although a plurality of wirings is formed on the connecting portion and the connecting terminals.

Magnetic head assembly having a rotational arm for electrically connecting the magnetic head to an external circuit and methods of manufacturing the same

A plurality of bonding structures and their forming methods for bonding a FPC to a bonding pad, in particular a bonding pad of a wireless suspension in a head gimbal assembly, using anisotropic conductive adhesive; such structures eliminate the spring-back force in typical anisotropic bonding to ensure durable bonding. At the same time, these structures also allow for reworkability under which the bonded parts can be separated easily.

An HAA has at least one HGA, each including a head slider with at least one head element, a suspension for supporting the head slider, and a lead conductor member electrically connected with the at least one head element, and a main body including at least one actuator arm for supporting the at least one HGA. The main body of the HAA is made of a metal material, and a surface of the main body is coated by a DLC film.

Head arm assembly, disk apparatus with head arm assembly and manufacturing method of head arm assembly

A magnetic head with an air bearing surface to which an appropriate roughness, a method of manufacturing the same, and a magnetic disk apparatus are provided. A head core part is formed on a base body made of altic formed by dispersing grain titanium carbide into alumina, and then an air bearing surface is formed. Next, plasma oxidation is performed so that a number of protrusions with height of about 5 nm are selectively formed only on the base-body region of the air bearing surface. The protrusions are composed of titanium oxide formed by the exposed portion among titanium carbide grains on the air bearing surface being selectively oxidized. Growth of the protrusions is promoted by applying photoresist on the ABS and removing it before performing plasma oxidation. The magnetic head has no risk of adsorbing a recording medium so that it has excellent CSS.

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Hong Kong, China

Ichiro Yagi