The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Aug. 15, 2007
Ichiro Yagi, HongKong, CN;
Defeng LU, Dongguan, CN;
Xiaogang Yang, Dongguan, CN;
Deyu He, Dongguan, CN;
Ichiro Yagi, HongKong, CN;
DeFeng Lu, Dongguan, CN;
XiaoGang Yang, Dongguan, CN;
DeYu He, Dongguan, CN;
SAE Magnetics (H.K.) Ltd., Hong Kong, CN;
Abstract
A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint.